2017年第六屆材料科學(xué)工程與技術(shù)國(guó)際會(huì)議 (ICMSET 2017)
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[ 會(huì)議基本信息 ]
會(huì)議名稱(中文): 2017年第六屆材料科學(xué)工程與技術(shù)國(guó)際會(huì)議 (ICMSET 2017)
會(huì)議名稱(英文): 2017 6th International Conference on Material Science and Engineering Technology (ICMSET 2017)
所屬學(xué)科: 納米科學(xué)與技術(shù),金屬材料,無機(jī)非金屬材料,復(fù)合材料,材料加工與處理
開始日期: 2017-10-20
結(jié)束日期: 2017-10-22
所在國(guó)家: 韓國(guó)
所在城市: 韓國(guó)
具體地點(diǎn):
主辦單位: 華盛頓大學(xué)路易斯分校
協(xié)辦單位: TTP
承辦單位: 首爾國(guó)立大學(xué)
議題:
[ 組織結(jié)構(gòu) ]
會(huì)議主席: Prof. Ramesh K. Agarwal, Washington University in St. Louis, USA
組織委員會(huì)主席: Assoc. Prof. Jean-Jacques DELAUNAY, The University of Tokyo, Japan
程序委員會(huì)主席: Prof.Shigeyuki Haruyama, Yamaguchi University, Japan
會(huì)議嘉賓:
姓名 職務(wù) 簡(jiǎn)介 演講題目
[ 重要日期 ]
摘要截稿日期: 2017-08-20
全文截稿日期: 2017-08-30
論文錄用通知日期: 2017-09-20
交修訂版截至日期: 2017-09-30
參會(huì)報(bào)名截止日期: 2017-09-30
[ 會(huì)務(wù)組聯(lián)系方式 ]
聯(lián)系人: MS. SILVIA LI
聯(lián)系電話: +86-18062000004
傳真:
E-MAIL: icmset@saise.org
通訊地址:
郵政編碼:
會(huì)議注冊(cè)費(fèi): 450 usd
會(huì)議網(wǎng)站: http://www.icmset.com/index.html
會(huì)議背景介紹:
The ICMSET conference is an international forum for the presentation of technological advances and research results in the fields of Material Science and Engineering Technology. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome previous and prospected authors submit your new research papers to ICMSET Conference, and share the valuable experiences with the scientist and scholars around the world.
This event will include the participation of renowned keynote speakers, oral presentations, posters sessions related to the topics dealt with in the Scientific Program as well as an attractive social and cultural program.